JPS6023014A - 電子部品の基板ブレ−ク装置 - Google Patents

電子部品の基板ブレ−ク装置

Info

Publication number
JPS6023014A
JPS6023014A JP58131327A JP13132783A JPS6023014A JP S6023014 A JPS6023014 A JP S6023014A JP 58131327 A JP58131327 A JP 58131327A JP 13132783 A JP13132783 A JP 13132783A JP S6023014 A JPS6023014 A JP S6023014A
Authority
JP
Japan
Prior art keywords
diameter roller
substrate
small diameter
small
breaking device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58131327A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6332602B2 (en]
Inventor
井上　胤一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58131327A priority Critical patent/JPS6023014A/ja
Publication of JPS6023014A publication Critical patent/JPS6023014A/ja
Publication of JPS6332602B2 publication Critical patent/JPS6332602B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP58131327A 1983-07-18 1983-07-18 電子部品の基板ブレ−ク装置 Granted JPS6023014A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58131327A JPS6023014A (ja) 1983-07-18 1983-07-18 電子部品の基板ブレ−ク装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58131327A JPS6023014A (ja) 1983-07-18 1983-07-18 電子部品の基板ブレ−ク装置

Publications (2)

Publication Number Publication Date
JPS6023014A true JPS6023014A (ja) 1985-02-05
JPS6332602B2 JPS6332602B2 (en]) 1988-06-30

Family

ID=15055354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58131327A Granted JPS6023014A (ja) 1983-07-18 1983-07-18 電子部品の基板ブレ−ク装置

Country Status (1)

Country Link
JP (1) JPS6023014A (en])

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62159404A (ja) * 1986-01-08 1987-07-15 ロ−ム株式会社 電子部品の材料バ−搬送方法
JPH038U (en]) * 1989-05-18 1991-01-07
JPH07111202A (ja) * 1993-10-12 1995-04-25 Rohm Co Ltd チップ部品用基板材のブレイク方法
JP2000223360A (ja) * 1999-01-28 2000-08-11 Tdk Corp 積層セラミックチップ部品の製造方法及び装置
JP2008140974A (ja) * 2006-12-01 2008-06-19 Kenyu:Kk 基板の自動分割方法、自動分割装置
CN105489403A (zh) * 2015-12-07 2016-04-13 苏州达力客自动化科技有限公司 一种用于电容贴片分离的滚压装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62159404A (ja) * 1986-01-08 1987-07-15 ロ−ム株式会社 電子部品の材料バ−搬送方法
JPH038U (en]) * 1989-05-18 1991-01-07
JPH07111202A (ja) * 1993-10-12 1995-04-25 Rohm Co Ltd チップ部品用基板材のブレイク方法
JP2000223360A (ja) * 1999-01-28 2000-08-11 Tdk Corp 積層セラミックチップ部品の製造方法及び装置
JP2008140974A (ja) * 2006-12-01 2008-06-19 Kenyu:Kk 基板の自動分割方法、自動分割装置
CN105489403A (zh) * 2015-12-07 2016-04-13 苏州达力客自动化科技有限公司 一种用于电容贴片分离的滚压装置

Also Published As

Publication number Publication date
JPS6332602B2 (en]) 1988-06-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees